... semiconductor storage unit 半导体存储器 semiconductor substrate 半导体衬底 semiconductor switch 半导体开关 ...
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In an embodiment, the method includes forming a gate dielectric layer on a semiconductor substrate.
实施例中，本方法包括在半导体衬底上形成栅极电介质层。
The assembly of the film frame tape, the thinned semiconductor substrate, and the C4 grind tape is diced.
切割膜框架带、减薄的半导体衬底和C4研磨带的组件。
A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate.
在半导体衬底的正面形成C4研磨带和激光烧蚀粘合层。
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